Solder joints for copper metallization having reduced...

Details Solder joints for copper metallization having reduced... Solder joints for copper metallization having reduced...

2007-09-11

2007-09-11

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S647000, C428S675000, C257S779000, C438S612000, C438S687000

Reexamination Certificate

active

11140785

ABSTRACT:
A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 μm in their main crystal direction. A body (102) of tin alloy is in contact with the bond pad.

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