Metal working
Method of mechanical manufacture
Electrical device making
Inventor
active
Bump connection and method and apparatus for forming said...
Bump connection with stacked metal balls
Method of fabricating multilayer printed circuit board
Multilayer printed circuit board having a concave metal portion
Process of forming bump on electrode of semiconductor chip and a
No associations
LandOfFree
Keizo Sakurai does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Keizo Sakurai, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Keizo Sakurai will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-796819