Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-04-04
2006-04-04
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S004500, C228S219000, C228S220000
Reexamination Certificate
active
07021521
ABSTRACT:
A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is obtained by forming the metallic balls using metallic wires. An apparatus for forming the connection includes a support, capillary member for having a wire pass therethrough, a pair of clamps for clamping the wire, and a “torch” (e.g., electrode, gas flame) which heats the tip of the wire, forming the ball. Successive balls can be formed by this apparatus atop the initially formed ball to provide a stacked configuration.
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Sakurai Hiroyuki
Sakurai Keizo
Bond Schoeneck & King , PLLC
International Business Machines - Corporation
McGuire George R.
Stoner Kiley S.
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