Process of forming bump on electrode of semiconductor chip and a

Details Process of forming bump on electrode of semiconductor chip and a Process of forming bump on electrode of semiconductor chip and a

1990-06-01

1991-10-29

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, 228160, B23K10140, H01L 21603

Patent

active

050608436

ABSTRACT:
A process of forming bumps on respective electrodes of a semiconductor chip comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool three-dimensionally movable, b) forming a small ball at the leading end of a wire passing through the bonding tool, c) causing the bonding tool to press the small ball against the upper surface of one of the electrodes for bonding thereto, d) moving the bonding tool in a direction leaving from the upper surface of the electrode by a distance, e) moving the bonding tool in a horizontal direction substantially parallel to the upper surface of the electrode so that the wire is cut from the small ball with the leading end of the bonding tool, and f) repeating the steps b) to e) for producing bumps on the respective upper surfaces of the other electrodes, in which the horizontal direction is different depending upon the location of the electrode.

REFERENCES:
patent: 3357090 (1967-12-01), Tiffany
patent: 4099663 (1978-04-01), Brill et al.
patent: 4230925 (1980-10-01), Lascelles
patent: 4442967 (1984-04-01), van de Pas et al.
patent: 4717066 (1988-01-01), Goldenberg et al.
patent: 4750666 (1988-06-01), Neugebauer et al.

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