Metal working – Method of mechanical manufacture – Electrical device making
Patent
1999-03-11
2000-08-22
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29829, 29843, H05K 336
Patent
active
061052434
ABSTRACT:
A method for fabricating a multilayer printed circuit board, as well as the resulting multilayer printed circuit board, is disclosed. The multilayer printed circuit board includes a substrate, a first conductive circuit layer, a photosensitive dielectric layer and a second conductive circuit layer which is electrically connected to the first conductive circuit layer through photo-via holes formed in the photosensitive dielectric layer. The second conductive circuit layer includes a wiring area where a plurality of wires are arranged and a pad area to which an external wire is to be connected using thermocompression bonding. Significantly, to avoid depressing the photosensitive dielectric layer underneath the pad area during the thermocompression bonding, the thickness of the second conductive circuit layer at least in the pad area, is made greater than that in the wiring area by extending this thickness into the photosensitive dielectric layer.
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patent: 5426849 (1995-06-01), Kimbara et al.
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5589250 (1996-12-01), Asai et al.
patent: 5628852 (1997-05-01), Ishida
Okabe Shuhichi
Sakurai Keizo
Arbes Carl J.
International Business Machines Corp.
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