4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Katsunori Asai

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Inventor

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Flip chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Method for manufacturing semiconductor device

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Package for semiconductor device laminated printed circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Packaged semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Profile ID: LFUS-PAI-P-161711

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