Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-09-06
1997-09-09
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257780, 257737, H01L 2348, H01L 2352
Patent
active
056660081
ABSTRACT:
A semiconductor device for life enhancement of electrical connections between a semiconductor chip and a mounting substrate. Protruding electrodes, each including a bump electrode and a land electrode, are located on the lower surface of an LSI chip. The bump electrodes are substantially spherical and have a first thickness. Connecting terminals of substantially spherical configuration and having a second thickness are directly connected to corresponding land electrodes by melting. Connecting patterns are located on the upper surface of a wiring board which is larger in area than the LSI chip in plan configuration, and external electrodes, each including a connecting pattern and an external electrode, are located on the lower surface of the wiring board. The external electrodes are substantially spherical and have a third thickness. The connecting patterns are directly connected to corresponding connecting terminals, respectively, by melting.
REFERENCES:
patent: 3380155 (1968-04-01), Burks
patent: 4871921 (1989-10-01), Gurnee
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5471096 (1995-11-01), Papathomas et al.
patent: 5550408 (1996-08-01), Kunitomo et al.
IBM TDB vol. 38 No. 07 Jul. 1995 "Repairable Plastic Ball Grid Array Package", pp. 265-266.
Asai Katsunori
Sawai Akiyoshi
Tomita Yoshihiro
Arroyo T. M.
Mitsubishi Denki & Kabushiki Kaisha
Ryoden Semiconductor System Engineering Corporation
Saadat Mahshid D.
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