4. Metal fusion bonding
  5. Solder form

Kathleen A. Stalter

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Ceramic ball grid array using in-situ solder stretch

Metal fusion bonding – Process – Plural joints
Patent

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Dielectric interposer for chip to substrate soldering

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Dielectric interposer for chip to substrate soldering

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Enhanced ceramic ball grid array using in-situ solder stretch wi

Stock material or miscellaneous articles – All metal or with adjacent metals – Shaped configuration for melting
Patent

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Enhanced ceramic ball grid array using in-situ solder stretch wi

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-380130

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