Enhanced ceramic ball grid array using in-situ solder stretch wi

Details Enhanced ceramic ball grid array using in-situ solder stretch wi Enhanced ceramic ball grid array using in-situ solder stretch wi

1997-08-12

1999-10-12

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 62, 228 19, 228 495, B23K 3102, B23K 3704

Patent

active

059643960

ABSTRACT:
A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

REFERENCES:
patent: 5148968 (1992-09-01), Schmidt et al.
patent: 5482200 (1996-01-01), Myers et al.
patent: 5573172 (1996-11-01), Gore
L. F. Miller, "Elongated Flexible Chip Joint," IBM Tech. Discl. Bull., vol. 10, No. 11 (Apr. 1968) p. 1670.
"Chip with Lengthened Solder Joints Using Shape Memory Alloy," IBM Tech. Discl. Bull., vol. 29, No. 12 (May 1987) pp. 5213-5214.

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