Metal fusion bonding – Process – Plural joints
Patent
1997-08-12
1999-11-02
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228 62, 228 19, 228 495, B23K 3102, B23K 3704
Patent
active
059754095
ABSTRACT:
A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
REFERENCES:
patent: 5148968 (1992-09-01), Schmidt et al.
patent: 5341979 (1994-08-01), Gupta
patent: 5441195 (1995-08-01), Tustaniwskyj et al.
patent: 5482200 (1996-01-01), Myers et al.
patent: 5573172 (1996-11-01), Gore
Microelectronics Packaging Handbook, Tummala et al., (1989) pp. 366-391.
Brofman Peter J.
Coico Patrick A.
Courtney Mark G.
Farooq Shaji
Goldmann Lewis S.
Ahsan Aziz M.
International Business Machines - Corporation
Knapp Jeffrey T.
Ryan Patrick
Tomaszewski John J.
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