Dielectric interposer for chip to substrate soldering

Details Dielectric interposer for chip to substrate soldering Dielectric interposer for chip to substrate soldering

2006-01-10

2006-01-10

Tugbang, A. Dexter (Department: 3729)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C257S779000, C257S781000

Reexamination Certificate

active

06984792

ABSTRACT:
A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.

REFERENCES:
patent: 3657610 (1972-04-01), Yamamoto et al.
patent: 4237522 (1980-12-01), Thompson
patent: 4693770 (1987-09-01), Hatada
patent: 4914814 (1990-04-01), Behun et al.
patent: 5111279 (1992-05-01), Pasch et al.
patent: 5569963 (1996-10-01), Rostoker et al.
patent: 5729896 (1998-03-01), Dalal et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5966593 (1999-10-01), Budnaitis et al.
patent: 5-13915 (1993-01-01), None
patent: 6-77649 (1994-03-01), None
Matijasevic et al., “Vertical Microvia Connections Achieved Using a Unique Conductive Composite Material”, 1998 IEMT/IMC Symposium, Apr. 1998, pp. 306-311.

Affiliated with

Also associated with

Rating

Dielectric interposer for chip to substrate soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dielectric interposer for chip to substrate soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dielectric interposer for chip to substrate soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3549000