4. Coating processes
  5. Electrical product produced
  6. Integrated circuit, printed circuit, or circuit board

Karl G. Hoebener

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Fine pitch solder deposits on printed circuit board process and

Metal fusion bonding – Process – Preplacing solid filler
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Interconnection structure and test method

Metal fusion bonding – Process – Plural joints
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Interconnection structure and test method

Metal fusion bonding – Solder form
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Method for forming bumps on a substrate

Metal fusion bonding – Process – Plural joints
Patent

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Method of attaching electronic components

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-83820

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