Metal fusion bonding – Process – Plural joints
Patent
1990-07-18
1991-10-29
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228203, 228215, 228246, B23K 100, B23K10140
Patent
active
050608444
ABSTRACT:
Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.
Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.
Finally, disclosed is a method of testing the solderability of the above structures.
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Behun John R.
Call Anson J.
Cappo Francis F.
Cole Marie S.
Hoebener Karl G.
Blecker Ira David
Heinrich Samuel M.
International Business Machines - Corporation
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