Metal fusion bonding – Solder form
Patent
1991-08-09
1992-09-15
Heinrich, Samuel M.
Metal fusion bonding
Solder form
228139, 228175, 228215, 228248, 228254, 2281802, 357 71, 174259, 174263, B23K10140, H05K 334, H01L 2160
Patent
active
051470845
ABSTRACT:
Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.
REFERENCES:
patent: 3719981 (1973-03-01), Steitz
patent: 4238528 (1980-12-01), Angelo et al.
patent: 4376505 (1983-03-01), Wojcik
patent: 4604644 (1986-08-01), Beckham et al.
"Insert Layer for Surface Mount Components", Research Disclosure, Jan. 1989, No. 297.
Behun John R.
Call Anson J.
Cappo Francis F.
Cole Marie S.
Hoebener Karl G.
Blecker Ira David
Heinrich Samuel M.
International Business Machines - Corporation
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