Method of attaching electronic components

Details Method of attaching electronic components Method of attaching electronic components

1989-08-31

1991-03-12

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

2281801, 2281802, 174260, 361400, 361403, H05K 334

Patent

active

049983423

ABSTRACT:
An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.

REFERENCES:
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4345371 (1982-08-01), Ohsawa et al.
patent: 4506443 (1985-03-01), Itoh
patent: 4515304 (1985-05-01), Berger
patent: 4664308 (1987-05-01), Boynton
patent: 4761881 (1988-08-01), Bora et al.
P. Bakos et al., "Enhanced Double-Sided Surface Mounted Assembly", Research Disclosure, 12/87, 284, Kenneth Mason Pub. Limited, England.
Double-Sided Surface Mount Process, Hewlett-Packard Journal, Jun., 1989, pp. 23-24.

Affiliated with

Also associated with

Rating

Method of attaching electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of attaching electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of attaching electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-441636