4. Coating processes
  5. With post-treatment of coating or coating material
  6. Heating or drying

Junnosuke Sekiguchi

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Electroless plating method and semiconductor wafer on which...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Electrolytic copper plating method, phosphorous copper anode...

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate

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Electronic component formed with barrier-seed layer on base...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Metal plating method, pretreatment agent, and semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of surface treatment using imidazole compound

Coating processes – With post-treatment of coating or coating material – Heating or drying
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2232122

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