4. Compositions: ceramic
  5. Ceramic compositions
  6. Refractory

Jun Monma

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Aluminum nitride wiring substrate

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Aluminum nitride wiring substrate and method for production ther

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Circuit substrate including insulating layer of aluminum nitride

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Semiconductor device having a tab chip on a tape carrier with le

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
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Sintered aluminum nitride and circuit substrate using sintered a

Compositions: ceramic – Ceramic compositions – Refractory
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Profile ID: LFUS-PAI-P-291432

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