Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1994-12-28
1998-09-08
Ryan, Patrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428210, 428901, B32B 900
Patent
active
058042881
ABSTRACT:
A formed aluminum nitride piece is produced by applying a wiring layer-forming metal paste containing such a high melting temperature metal (wiring metal) as tungsten, for example, to an aluminum nitride green sheet and shaping one layer of the aluminum nitride green sheet now bearing the applied metal paste or superposing a plurality of such layers. In this case, a manganese component destined to densify tungsten is incorporated in at least either of the green sheet and the wiring layer-forming metal paste. The manganese component is either manganese as a simple metallic element or such a manganese compound as manganese oxide. Then, the formed aluminum nitride piece is fired to effect simultaneous sintering of an aluminum nitride and tungsten. Owing to the preparatory addition of the manganese component, a complex compound such as a complex oxide containing manganese and tungsten or a complex such as a eutectic alloy of manganese and tungsten is formed in the wiring metal layer. The wiring metal layer contains manganese at a ratio of not more than 2% by weight in addition to tungsten. Since the complex accelerates the granular growth of tungsten, a tungsten layer (wiring metal layer) densified to an extent of lowering the porosity thereof below 2% is obtained.
REFERENCES:
patent: 4861641 (1989-08-01), Foster
patent: 4871608 (1989-10-01), Kondo
patent: 5124284 (1992-06-01), Ishida
patent: 5167869 (1992-12-01), Nebe
patent: 5229213 (1993-07-01), Horivchi
patent: 5271962 (1993-12-01), Alexander
patent: 5413842 (1995-05-01), Felitsberto
Jewik Patrick
Kabushiki Kaisha Toshiba
Ryan Patrick
LandOfFree
Aluminum nitride wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Aluminum nitride wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aluminum nitride wiring substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1280278