4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Julia Aksenton

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Methods and apparatus for packaging integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Methods and apparatus for packaging integrated circuit devices

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Methods and apparatus for packaging integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Methods and apparatus for packaging integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2896554

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