4. Optical: systems and elements
  5. Optical modulator
  6. Light wave temporal modulation

Ju-Ai Ruan

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Method for reducing contamination, copper reduction, and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Reduction of punch-thru defects in damascene processing

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor device having improved adhesion and reduced...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor device manufactured by reducing hillock...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Shallow trench isolation planarization using self aligned...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2358862

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