4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Joseph D. Fernandez

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Apparatus and method for removing semiconductor chips from a dic

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Integrated circuit package having interchip bonding and method t

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Integrated circuit package having interchip bonding and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Single die stitch bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-391459

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