Integrated circuit package having interchip bonding and method t

Details Integrated circuit package having interchip bonding and method t Integrated circuit package having interchip bonding and method t

1998-03-06

2000-12-12

Smith, Matthew

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438111, 438123, 438125, H01L 2160, H05K 334

Patent

active

061597651

ABSTRACT:
An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.

REFERENCES:
patent: 5084753 (1992-01-01), Golda et al.
patent: 5113580 (1992-05-01), Schroeder et al.
patent: 5289043 (1994-02-01), Marshall et al.
patent: 5783463 (1998-07-01), Takehashi
patent: 5789816 (1998-08-01), Wu
patent: 6080931 (2000-06-01), Park et al.
PCT International Search Report dated Jun. 15, 1999.

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