Apparatus and method for removing semiconductor chips from a dic

Details Apparatus and method for removing semiconductor chips from a dic Apparatus and method for removing semiconductor chips from a dic

1997-08-14

2000-10-31

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 438464, 438976, B32B 3500

Patent

active

061396761

ABSTRACT:
An apparatus and method is disclosed for removing a selected semiconductor chip from a semiconductor wafer. The selected semiconductor chip is elevated by the use of an X--Y--Z assembly by having a rounded tip portion of a round probe member assembly that is part of the X--Y--Z assembly contact a back portion of a flexible, transparent backing layer beneath the selected semiconductor chip so that removal of the semiconductor chip can be completed by using a vacuum type pencil.

REFERENCES:
patent: 4859269 (1989-08-01), Nishiguchi
patent: 4865677 (1989-09-01), Matsushita et al.
patent: 5725728 (1998-03-01), Fuke et al.

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