Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2000-12-08
2001-12-25
Smith, Matthew (Department: 2825)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S675000, C257S685000, C257S723000, C257S777000, C257S780000
Reexamination Certificate
active
06333549
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates generally to integrated circuits and, more specifically, to an integrated circuit package having at least two devices mounted therein. The two devices are able to communicate with one another and/or control one another through interdevice bonding.
2. Description of the Prior Art
Presently, most integrated circuit (IC) packages have a single device mounted within the IC package. The problem with these types of IC packages is that the functionality of the IC package is limited to the functionality of the device within the IC package. The only ways to increase the functionality of the IC package would be to either redesign the device within the IC package, or to use two separate IC packages to obtain the desired functions. Neither of these options are highly desirable. Redesigning the device is both time consuming and expensive. Using two separate IC packages will take up valuable silicon and printed circuit board real estate.
Therefore, a need existed to provide an improved IC package. The improved IC package must have the flexibility to combine additional functionality to the device within the IC package. The improved IC package must have the flexibility to combine additional functionality to the device within the improved IC package at a minimal cost and without requiring additional silicon real estate to be used. The improved IC package must allow for a plurality of different devices to be mounted to a standard leadframe die paddle configuration. The improved IC package must further allow the plurality of different devices within the improved IC device to communicate and control (i.e., power up and power down) one another.
SUMMARY OF THE INVENTION
In accordance with one embodiment of the present invention, it is an object of the present invention to provide an improved IC package.
It is another object of the present invention to provide an improved IC package that has the flexibility to combine additional functionality to the device within the improved IC package.
It is still another object of the present invention to provided an improved IC package that has the flexibility to combine additional functionality from the same or different technologies to the device within the improved IC package at a minimal cost and without requiring additional silicon or printed circuit board real estate to be used.
It is yet another object of the present invention to provide an improved IC package that allows for a plurality of different devices to be mounted to a standard leadframe die paddle configuration.
It is still a further object of the present invention to provide an improved IC package that allows the plurality of different devices mounted to a standard leadframe die paddle configuration to communicate and control (i.e., power up and power down) one another through interdevice bonding.
BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENTS
In accordance with one embodiment of the present invention, an integrated circuit package is disclosed that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate with one another.
In accordance with another embodiment of the present invention, a method of providing an integrated circuit package having the ability for interdevice communication is disclosed. The method comprises the steps of: providing a standard platform; mounting a first device on the standard platform; mounting a second device on the standard platform; coupling the first device and the second device to pins on the standard platform; and directly coupling the first device to the second device by wirebonding to allow the first device to at least one of communicate and control the second device. The standard platform may be a standard die paddle/lead frame configuration or a substrate of a printed circuit board.
The foregoing and other objects, features, and advantages of the invention will be apparent from the following, more particular, description of the preferred embodiments of the invention, as illustrated in the accompanying drawings.
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Charles Mike
Drehobl Steve V.
Fernandez Joseph D.
Anya Igwe
Baker & Botts L.L.P.
Microchip Technology Incorporated
Smith Matthew
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