Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
Inventor
active
Ball grid array package-to-board interconnect co-design...
Electronic device package--carrier assembly ready to be mounted
Elongated bonding pad for wire bonding and sort probing
Integrated circuit die-to-leadframe interconnect assembly system
Integrated circuit package with device and wire coat assembly
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Profile ID: LFUS-PAI-P-55676