Integrated circuit die-to-leadframe interconnect assembly system

Details Integrated circuit die-to-leadframe interconnect assembly system Integrated circuit die-to-leadframe interconnect assembly system

1991-09-16

1993-08-03

Abrams, Neil

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29827, 439876, H01L 23495

Patent

active

052331318

ABSTRACT:
To bridge the gap between a semiconductor die and the leads of a leadframe, an insulating bridging and support member is used to support the die. The member has thereon conductive traces connected to the die. Provided in the interior portion of the member away from its edges are connecting structures such as holes, slots or grooves. The leads have bent end portions engaging the holes, slots or grooves. The bent end portions are soldered or otherwise connected to the inner surfaces of the holes, slots or grooves by soldering to electrically connect the leads to the traces and to physically attach the member to the leadframe. The above-described structure permits the bonding sites between adjacent leads to the member to be greater than lead spacing of the leadframe. The leads are in the shape of elongated rods of uniform cross-section to maximize the lead density possible around the bridging and support member.

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"Multi-Layer Molded Plastic Package," by D. Mallik, Intel Corp., (Table of Contents, pp. 2, 4, 6, 8).

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