Electronic device package--carrier assembly ready to be mounted

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

174 522, 257787, H01L 2302, H01L 2328

Patent

active

052103757

ABSTRACT:
The exposed portions of the leads of a semiconductor chip package are first bent in a forming process so that the ends of the leads are in proper positions to be attached to and electrically connected to contacts on a printed circuit board. Intermediate portions of the leads between the distal ends and the package body for connection to the printed circuit board and the package body are enclosed and fixed in position by a carrier body to hold the leads in position and to reduce the effects of any bending in destroying the coplanarity of the distal lead ends of the package. The package with the carrier body may be mounted onto the printed circuit board without first removing the carrier body. After the distal ends of the leads have been soldered to the printed circuit board, the carrier body is then removed.

REFERENCES:
patent: 3219748 (1965-11-01), Miller
patent: 3778685 (1973-12-01), Kennedy
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4707725 (1987-11-01), Ito
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4837184 (1989-06-01), Lin et al.
patent: 4855807 (1989-08-01), Yamaji et al.
patent: 4897602 (1990-01-01), Lin et al.

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