4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

John Trezza

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Chip capacitive coupling

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Coaxial through chip connection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Coaxial through chip connection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Coaxial through chip connection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Combination micromachine and optical device array

Optical: systems and elements – Optical modulator – Light wave temporal modulation
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Profile ID: LFUS-PAI-P-2183737

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