Coaxial through chip connection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21575, C257SE21597, C438S459000, C438S618000

Reexamination Certificate

active

08067312

ABSTRACT:
An integrated circuit chip includes devices formed by doping of a semiconductor on a substrate and at least one post-device formation through-chip via made up of an annulus of insulating material, an annulus of metallization bounding an outer surface of the annulus of insulating material and an annulus of electrically conductive material within the annulus of insulating material, the annulus of metallization and the annulus of electrically conductive material being electrically isolated from each another.

REFERENCES:
patent: 3312878 (1967-04-01), Poch et al.
patent: 3591839 (1971-07-01), Evans
patent: 3720309 (1973-03-01), Weir
patent: 4200272 (1980-04-01), Godding
patent: 4452557 (1984-06-01), Bouwknegt et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4873205 (1989-10-01), Critchlow et al.
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 4893174 (1990-01-01), Yamada et al.
patent: 4915494 (1990-04-01), Shipley et al.
patent: 4967248 (1990-10-01), Shimizu
patent: 4999077 (1991-03-01), Drake et al.
patent: 5089055 (1992-02-01), Nakamura
patent: 5089880 (1992-02-01), Meyer et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5100480 (1992-03-01), Hayafuji et al.
patent: 5120597 (1992-06-01), Takimoto et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5179043 (1993-01-01), Weichold et al.
patent: 5220530 (1993-06-01), Itoh
patent: 5229315 (1993-07-01), Jun et al.
patent: 5234149 (1993-08-01), Katz
patent: 5236854 (1993-08-01), Higaki
patent: 5266912 (1993-11-01), Kledzik
patent: 5308784 (1994-05-01), Kim et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5427834 (1995-06-01), Sodetz
patent: 5468655 (1995-11-01), Greer
patent: 5470787 (1995-11-01), Greer
patent: 5510655 (1996-04-01), Tanielian
patent: 5523628 (1996-06-01), Williams et al.
patent: 5561594 (1996-10-01), Wakefield
patent: 5563084 (1996-10-01), Ramm et al.
patent: 5587119 (1996-12-01), White
patent: 5589029 (1996-12-01), Matsui et al.
patent: 5598965 (1997-02-01), Scheu
patent: 5608264 (1997-03-01), Gaul
patent: 5635014 (1997-06-01), Taylor
patent: 5708569 (1998-01-01), Howard et al.
patent: 5737186 (1998-04-01), Fuesser et al.
patent: 5773889 (1998-06-01), Love et al.
patent: 5780776 (1998-07-01), Noda
patent: 5796591 (1998-08-01), Dalal et al.
patent: 5814889 (1998-09-01), Gaul
patent: 5846464 (1998-12-01), Hoffman
patent: 5872338 (1999-02-01), Lan et al.
patent: 5874780 (1999-02-01), Murakami
patent: 5897337 (1999-04-01), Kata et al.
patent: 5912510 (1999-06-01), Hwang et al.
patent: 5929524 (1999-07-01), Drynan et al.
patent: 5962922 (1999-10-01), Wang
patent: 5963793 (1999-10-01), Rinne et al.
patent: 5973396 (1999-10-01), Farnworth
patent: 6030894 (2000-02-01), Hada et al.
patent: 6037665 (2000-03-01), Miyazaki
patent: 6075710 (2000-06-01), Lau
patent: 6084301 (2000-07-01), Chang et al.
patent: 6087719 (2000-07-01), Tsunashima
patent: 6118181 (2000-09-01), Merchant et al.
patent: 6133631 (2000-10-01), Belady
patent: 6135054 (2000-10-01), Inoue
patent: 6135635 (2000-10-01), Miller et al.
patent: 6137184 (2000-10-01), Ikegami
patent: 6184066 (2001-02-01), Chino et al.
patent: 6188118 (2001-02-01), Severn
patent: 6207475 (2001-03-01), Lin et al.
patent: 6215114 (2001-04-01), Yagi et al.
patent: 6232668 (2001-05-01), Hikita et al.
patent: 6277711 (2001-08-01), Wu
patent: 6283693 (2001-09-01), Acello et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6314013 (2001-11-01), Ahn et al.
patent: 6316737 (2001-11-01), Evans et al.
patent: 6316786 (2001-11-01), Mueller et al.
patent: 6326115 (2001-12-01), Nakanishi et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6393638 (2002-05-01), MacColl
patent: 6395630 (2002-05-01), Ahn et al.
patent: 6395633 (2002-05-01), Cheng et al.
patent: 6399426 (2002-06-01), Capote
patent: 6410415 (2002-06-01), Estes
patent: 6410431 (2002-06-01), Bertin et al.
patent: 6429045 (2002-08-01), Furukawa et al.
patent: 6451626 (2002-09-01), Lin
patent: 6484776 (2002-11-01), Meilunas et al.
patent: 6492255 (2002-12-01), Enomoto et al.
patent: 6498089 (2002-12-01), Komada
patent: 6498503 (2002-12-01), Akram et al.
patent: 6501185 (2002-12-01), Chow
patent: 6503779 (2003-01-01), Miyazaki
patent: 6509256 (2003-01-01), Medlen et al.
patent: 6513236 (2003-02-01), Tsukamoto
patent: 6531022 (2003-03-01), Tsukahara
patent: 6544371 (2003-04-01), Senoo et al.
patent: 6551858 (2003-04-01), Kawata et al.
patent: 6555418 (2003-04-01), Kurosawa et al.
patent: 6557192 (2003-05-01), Zheng
patent: 6559540 (2003-05-01), Kawashima
patent: 6576830 (2003-06-01), Nagao et al.
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6583517 (2003-06-01), Jimarez
patent: 6586090 (2003-07-01), Nakagawa et al.
patent: 6590278 (2003-07-01), Behun et al.
patent: 6596640 (2003-07-01), Fishcer et al.
patent: 6599778 (2003-07-01), Pogge et al.
patent: 6611057 (2003-08-01), Mikubo et al.
patent: 6617507 (2003-09-01), Mapes et al.
patent: 6617688 (2003-09-01), Ikegami et al.
patent: 6627477 (2003-09-01), Hakey et al.
patent: 6633079 (2003-10-01), Cheever et al.
patent: 6635960 (2003-10-01), Farrar et al.
patent: 6635970 (2003-10-01), Lasky et al.
patent: 6649941 (2003-11-01), Uemura
patent: 6674647 (2004-01-01), Pierson et al.
patent: 6680540 (2004-01-01), Nakano
patent: 6686654 (2004-02-01), Farrar et al.
patent: 6689627 (2004-02-01), Mottura et al.
patent: 6689949 (2004-02-01), Ortabasi
patent: 6703555 (2004-03-01), Takabayashi et al.
patent: 6704953 (2004-03-01), Fishman
patent: 6706554 (2004-03-01), Ogura
patent: 6717045 (2004-04-01), Chen
patent: 6717071 (2004-04-01), Chang et al.
patent: 6720245 (2004-04-01), Stucchi et al.
patent: 6727582 (2004-04-01), Shibata
patent: 6730840 (2004-05-01), Sasaoka et al.
patent: 6731003 (2004-05-01), Joshi et al.
patent: 6733685 (2004-05-01), Beilin et al.
patent: 6740576 (2004-05-01), Lin et al.
patent: 6756594 (2004-06-01), George et al.
patent: 6756680 (2004-06-01), Jimarez et al.
patent: 6765287 (2004-07-01), Lin
patent: 6768210 (2004-07-01), Zuniga-Ortiz et al.
patent: 6770509 (2004-08-01), Halope et al.
patent: 6770555 (2004-08-01), Yamazaki
patent: 6770822 (2004-08-01), Pasternak et al.
patent: 6780280 (2004-08-01), Halterbeck et al.
patent: 6790663 (2004-09-01), Kerr et al.
patent: 6798030 (2004-09-01), Izumi et al.
patent: 6809020 (2004-10-01), Sakurai et al.
patent: 6815252 (2004-11-01), Pendse
patent: 6818818 (2004-11-01), Bareis
patent: 6824643 (2004-11-01), Yoshimoto et al.
patent: 6838362 (2005-01-01), Mastromatteo et al.
patent: 6841883 (2005-01-01), Farnworth et al.
patent: 6844259 (2005-01-01), Cheong
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 6861336 (2005-03-01), Hampton
patent: 6869856 (2005-03-01), Combi et al.
patent: 6872635 (2005-03-01), Hayashi et al.
patent: 6881609 (2005-04-01), Salmon
patent: 6889427 (2005-05-01), Yee et al.
patent: 6903443 (2005-06-01), Farnworth et al.
patent: 6909180 (2005-06-01), Ono et al.
patent: 6919642 (2005-07-01), Hsieh et al.
patent: 6920051 (2005-07-01), Figueroa et al.
patent: 6929974 (2005-08-01), Ding et al.
patent: 6938783 (2005-09-01), Chung
patent: 6939789 (2005-09-01), Huang et al.
patent: 6967307 (2005-11-01), Hembree et al.
patent: 6975027 (2005-12-01), Farrar et al.
patent: 6986377 (2006-01-01), Johnson et al.
patent: 6992824 (2006-01-01), Motamedi et al.
patent: 6995469 (2006-02-01), Hatakeyama
patent: 7013509 (2006-03-01), Hickman
patent: 7015590 (2006-03-01), Jeong et al.
patent: 7023347 (2006-04-01), Arneson et al.
patent: 7033859 (2006-04-01), Pendse
patent: 7052941 (2006-05-01), Lee
patent: 7053456 (2006-05-01), Matsuo
patent: 7056813 (2006-06-01), Morrow et al.
patent: 7061104 (2006-06-01), Kenny et al.
patent: 7107666 (2006-09-01), Hiatt et al.
patent: 7115505 (2006-10-01), Hartwell
patent: 7115984 (2006-10-01), Poo et al.
patent: 7135777 (2006-11-01), Bakir et al.
patent: 7138706 (2006-11-01), Arai et al.
patent: 7141869 (2006-11-01), Kim et al.
patent: 7144759 (2006-12-01), Hilton et al.
patent: 7145236 (2006-12-01), Miura et al.
patent: 7157310 (2007-01-01), Benson et al.
patent: 7157372 (2007-01-01), Trezza
patent: 71701

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Coaxial through chip connection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coaxial through chip connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coaxial through chip connection will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4273289

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.