4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Bipolar transistor structure
  6. With specified electrode means

John L. Freeman, Jr.

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Method for damage avoidance in transferring an ultra-thin...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Method for making a planar multi-layer metal bonding pad

Fishing – trapping – and vermin destroying
Patent

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Method of manufacturing a semiconductor component

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Complementary bipolar transistors
Reexamination Certificate

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Multiple step metallization process

Fishing – trapping – and vermin destroying
Patent

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Planar multi-layer metal bonding pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Profile ID: LFUS-PAI-P-126276

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