Method for making a planar multi-layer metal bonding pad

Details Method for making a planar multi-layer metal bonding pad Method for making a planar multi-layer metal bonding pad

1991-06-17

1992-09-22

Quach, T.

Fishing, trapping, and vermin destroying

437203, 437211, H01L 21283

Patent

active

051496747

ABSTRACT:
A method is provided for planarizing a multi-layer metal bonding pad. A first metal layer (13) is provided. A first dielectric layer (14) is provided with a multitude of vias (17) covering the first metal layer (13), thereby exposing portions of the first metal layer (13) through the multitude of vias (17) in the first dielectric (14). A second metal layer (18) is deposited on the first dielectric layer (14) making electrical contact to the first metal layer through the multitude of vias (17). Planarization of the second metal layer (18) is achieved by having the second metal layer (18) cover the first dielectric layer (14) and making contact through the vias (17).

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