4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

John E. Heidenreich, III

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Copper to aluminum interlayer interconnect using stud and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Copper to aluminum interlayer interconnect using stud and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Metal-insulator-metal capacitor in copper

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate

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Method and apparatus for contamination control in processing app

Electric heating – Metal heating – By arc
Patent

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Method for enhancing the adhesion of polymer surfaces by water v

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-84132

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