4. Coating processes
  5. Direct application of electrical, magnetic, wave, or...
  6. Pretreatment of substrate or post-treatment of coated substrate

Jiong-Ping Lu

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Barrier/liner with a SiNx-enriched surface layer on MOCVD prepar

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent

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Capacitor formed on a recrystallized polysilicon layer

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate

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Copper bond pad process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Copper surface passivation during semiconductor manufacturing

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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FUSI integration method using SOG as a sacrificial...

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate

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Profile ID: LFUS-PAI-P-318522

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