4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Jin-Yuan Lee

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Anti-punchthrough ion implantation for sub-half micron channel l

Fishing – trapping – and vermin destroying
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Apparatus to electroless plate a metal layer while...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Bonding structure with pillar and cap

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Buried contact process

Fishing – trapping – and vermin destroying
Patent

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Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-125340

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