4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Jill L. Flaugher

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Fabrication of pad array carriers from a universal interconnect

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Flexible film chip carrier having a flexible film substrate and

Patent

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Method for adhering polyimide to a substrate

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Method of making high density solder bumps and a substrate socke

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Transmission line using fluroplastic as a dielectric

Wave transmission lines and networks – Long lines – Strip type
Patent

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Profile ID: LFUS-PAI-P-280088

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