Method for adhering polyimide to a substrate

Details Method for adhering polyimide to a substrate Method for adhering polyimide to a substrate

1990-09-19

1993-03-30

Bell, Janyce

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427302, 427304, 427306, 427307, 427337, 427343, 427404, 4274121, 4274191, 4274195, B05D 310

Patent

active

051982641

ABSTRACT:
A method of adhering a polyimide to a substrate includes first placing the substrate in a dilute acid solution. The substrate is then placed in a palladium and tin solution followed by a rinse with water. The rinsed substrate is placed in an accelerator solution to substantially remove the tin from the substrate. The palladium which remains on the substrate surface provides nucleation sites for adhesion promotion and enhanced wetting of polyimide which is applied in a liquid form as by spraying or spinning. Adhesion of polyimide to metals such as gold, ceramics, alumina or polyimide is thereby provided.

REFERENCES:
patent: 4238528 (1980-12-01), Angelo et al.
patent: 4362783 (1982-12-01), Graham
patent: 4719145 (1988-01-01), Neely
patent: 4859571 (1989-08-01), Cohen et al.
patent: 4880684 (1989-11-01), Boss et al.

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