Fabrication of pad array carriers from a universal interconnect

Details Fabrication of pad array carriers from a universal interconnect Fabrication of pad array carriers from a universal interconnect

1989-12-07

1991-04-09

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174263, 174264, 29846, H05K 300

Patent

active

050066730

ABSTRACT:
A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes. On the first side, wire bond pads and conductors connected to the conductively filled through-holes are provided as required. Similarly, on the second side, solder pads on the conductively filled through-holes are provided as required. Finally, at least one insulating layer is provided over part of the first side for die attachment.

REFERENCES:
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4710592 (1987-12-01), Kimbara

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