Transmission line using fluroplastic as a dielectric

Details Transmission line using fluroplastic as a dielectric Transmission line using fluroplastic as a dielectric

1990-09-04

1991-11-12

Gensler, Paul

Wave transmission lines and networks

Long lines

Strip type

29600, H01P 308

Patent

active

050651226

ABSTRACT:
A multilayer substrate having an integral transmission line structure 300 is disclosed. The transmission line structure 300 is formed by metallizing a fluroplastic substrate on the inner surface 112 and outer surface 114 in order to form a transmission line. The metallized inner surface forms a conductive runner 106, while the outer metallized surface 114 forms a ground plane, with the fluroplastic substrate being the dielectric. The transmission line structure 300 is then encapsulated by two substrate layers (402, 404).

REFERENCES:
patent: 3586757 (1971-06-01), Haldeman, Jr.
patent: 3612744 (1971-10-01), Thomas
patent: 3895435 (1975-07-01), Turner et al.
patent: 4494083 (1985-01-01), Josefsson et al.
patent: 4812792 (1989-03-01), Leibowitz
patent: 4825283 (1989-04-01), Shino
patent: 4983237 (1991-01-01), Alfing

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