Flexible film chip carrier having a flexible film substrate and

Details Flexible film chip carrier having a flexible film substrate and Flexible film chip carrier having a flexible film substrate and

1991-07-09

1992-07-28

James, Andrew J.

357 80, 357 81, H01L 2302

Patent

active

051344629

ABSTRACT:
A flexible film is made into a substrate (100) having metallization patterns. A semiconductor device (106) is affixed to the substrate, and the assembly is heated to expand the substrate. A cover (110) is attached to the substrate, over the device (106). Upon cooling, the substrate (100) shrinks and becomes taut and planar within the reinforced area. Alternatively, a reinforcing ring (210) can be attached to the substrate (200) either before or after attachment of the semiconductor device (206).

REFERENCES:
patent: 3072832 (1959-05-01), Kilby
patent: 3885304 (1975-05-01), Kaiser et al.
patent: 4218701 (1980-08-01), Shirasaki
patent: 4855867 (1989-08-01), Gazdik et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 4970579 (1990-11-01), Arldt et al.

Affiliated with

Also associated with

Rating

Flexible film chip carrier having a flexible film substrate and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible film chip carrier having a flexible film substrate and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible film chip carrier having a flexible film substrate and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1690054