4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Jian Jun Li

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Chip scale package with open substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Cost effective substrate fabrication for flip-chip packages

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Integrated circuit package and manufacturing method therefor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Integrated circuit package with open substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2764068

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