Integrated circuit package

Details Integrated circuit package Integrated circuit package

2005-12-27

2005-12-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S782000, C257S783000, C257S786000

Reexamination Certificate

active

06979907

ABSTRACT:
An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.

REFERENCES:
patent: 5736789 (1998-04-01), Moscicki
patent: 5808873 (1998-09-01), Celaya et al.
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6034437 (2000-03-01), Shibata
patent: 6593658 (2003-07-01), Huang et al.
patent: 6707152 (2004-03-01), Schrock
patent: 5-129366 (1993-05-01), None

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