Integrated circuit package with open substrate

Details Integrated circuit package with open substrate Integrated circuit package with open substrate

2005-11-18

2009-12-01

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S685000, C257S777000, C257S773000, C257S782000, C257SE23067

Reexamination Certificate

active

07626277

ABSTRACT:
An integrated circuit package comprises a substrate including a core layer with a through opening and vias. A first conductive layer is on the core layer covering the through opening and a second conductive layer is on the core layer opposite the first conductive layer in the through opening and in the vias contacting the first conductive layer. An integrated circuit die is bonded to the second conductive layer and in the through opening. Connections are between the integrated circuit die and the second conductive layer, and the integrated circuit die and the connections are encapsulated.

REFERENCES:
patent: 5541450 (1996-07-01), Jones et al.
patent: 6515356 (2003-02-01), Shin et al.
patent: 6537848 (2003-03-01), Camenforte et al.
patent: 2003/0025199 (2003-02-01), Wu et al.

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