Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Examiner
active
No affiliations
Backside contact for touchchip
Ball limiting metalization process for interconnection
Barrier layer
Barrier materials for semiconductor devices
Bipolar electrostatic chuck and method of making same
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Profile ID: LFUS-PAI-P-65929