4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Jeffrey D. Punzalan

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Dual row leadframe and fabrication method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Dual row leadframe and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Dual row leadframe and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Ground plane for exposed package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Integrated circuit package system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2232498

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