Integrated circuit package system

Details Integrated circuit package system Integrated circuit package system

2011-04-19

2011-04-19

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S669000, C257S674000, C257SE23031, C257SE23043, C257SE23045, C257SE23046, C438S123000, C361S813000

Reexamination Certificate

active

07928540

ABSTRACT:
An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.

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