4. Metal fusion bonding
  5. Process of disassembling bonded surfaces, per se

Jay J. Liu

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Device for removing solder

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Patent

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Device for solder removal

Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent

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Method and apparatus for removing solder

Cleaning and liquid contact with solids – Processes – Including melting
Patent

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Semiconductor chip bonded to a substrate and method of making

Fishing – trapping – and vermin destroying
Patent

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Profile ID: LFUS-PAI-P-1030813

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