Device for removing solder

Details Device for removing solder Device for removing solder

1990-01-19

1991-11-19

Ramsey, Kenneth J.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

428163, 428164, B23K 1018

Patent

active

050659316

ABSTRACT:
In a process for repairing electronic device packages, the problem of removing solder remnants on substrate bonding pads is solved by, first etching a pattern in silicon and metallizing the pattern to make a silicon wick. The solder remnants on the bonding pads are melted, and the etched pattern of the silicon wick is brought into contact with the remnants to remove them by capillary action. It is often convenient to heat the silicon wick so that solder remnants melt when the wick is brought into contact with them.

REFERENCES:
patent: 3751799 (1973-08-01), Reynolds
patent: 4327135 (1982-04-01), Wirz et al.
Karl J. Puttlitz, "Flip-Chip Replacement within the Constraints Imposed by Multilayer Ceramic (MLC) Modules", Journal of Electronic Materials, vol. 13, No. 1, pp. 29-46, 1984.
Kenneth E. Bean, "Anisotropic Etching of Silicon", IEEE Transactions on Electron Devices, vol. ED-25, No. 10, pp. 1185-1193, Oct., 1978.

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