Method and apparatus for removing solder

Details Method and apparatus for removing solder Method and apparatus for removing solder

1988-10-11

1990-05-08

Pal, Asok

Cleaning and liquid contact with solids

Processes

Including melting

228119, 228124, B08B 700, B23K 3102

Patent

active

049235214

ABSTRACT:
In a process for repairing electronic device packages, the problem of removing solder remnants on substrate bonding pads is solved by, first, etching a pattern in silicon and metallizing the pattern to make a silicon wick. The solder remnants on the bonding pads are melted, and the etched pattern of the silicon wick is brought into contact with the remnants to remove them by capillary action. It is often convenient to heat the silicon wick so that solder remnants melt when the wick is brought into contact with them.

REFERENCES:
patent: 3751799 (1973-08-01), Reynolds
patent: 4323631 (1982-04-01), Spirig
"IBM Technical Disclosure Bulletin", vol. 27, No. 9, Feb. 1985.
Karl J. Puttlitz, "Flip-Chip Replacement Within the Constraints Imposed by Multilayer Ceramic (MLC) Modules," Journal of Electronic Materials, vol. 13, No. 1, pp. 29-46, 1984.
Kenneth E. Bean, "Anisotropic Etching of Silicon," IEEE Transactions on Electron Devices, vol ED-25, No. 10, pp. 1185-1193, Oct., 1978.

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