Semiconductor chip bonded to a substrate and method of making

Fishing – trapping – and vermin destroying

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437211, 437214, 437217, 437219, H01L 2160

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active

053858697

ABSTRACT:
A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.

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D. Suryanarayana et al, "Flip Chip Solder Bump Fatigue Life Enhanced by Polymer Encapsulation," 40th Electronic Component Technology Conference Proceedings, 1990, pp. 338-344.
T. Caulfield et al., "Surface Mount Array Interconnections for High I/O MCM-C to Card Assemblies," 1993 Proceedings of International Conference and Exhibition on Multichip Modules, pp. 320-325.

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