Fishing – trapping – and vermin destroying
Patent
1993-07-22
1995-01-31
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437211, 437214, 437217, 437219, H01L 2160
Patent
active
053858697
ABSTRACT:
A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.
REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4604644 (1986-06-01), Beckham et al.
patent: 4994411 (1991-02-01), Naito et al.
patent: 5008213 (1991-04-01), Holesar, Jr.
patent: 5057458 (1991-10-01), Hoeberechts et al.
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
D. Suryanarayana et al, "Flip Chip Solder Bump Fatigue Life Enhanced by Polymer Encapsulation," 40th Electronic Component Technology Conference Proceedings, 1990, pp. 338-344.
T. Caulfield et al., "Surface Mount Array Interconnections for High I/O MCM-C to Card Assemblies," 1993 Proceedings of International Conference and Exhibition on Multichip Modules, pp. 320-325.
Berg Howard M.
Hawkins George W.
Liu Jay J.
Hearn Brian E.
Jackson Miriam
Motorola Inc.
Picardat Kevin M.
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