4. Typewriting machines
  5. Platen or platen-moving mechanism
  6. Cylindrical platen

James W. Adkisson

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Bond pad for wafer and package for CMOS imager

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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CMOS imager photodiode with enhanced capacitance

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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CMOS imager with Cu wiring and method of eliminating high...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Damascene copper wiring image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Damascene copper wiring optical image sensor

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-245295

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